Thermal Gap Pad – How to Select the Right Thermal Gap Filler for Your Application

Dissipating heat is a major concern with the miniaturization of electronics. Whether your components are being used in an electric vehicle, mobile phone or high-performance computer, thermal management is essential to maintain performance and reliability. Thermal gap fillers can help. These soft pads – also known by the name thermal interface materials – are used to fill gaps and uneven areas between power-producing units and their corresponding heat sinks or metal casings. They provide a low pressure, stress-absorbing material that can prevent damage to electronic components while increasing thermal performance and cooling.

Thermal gap fillers can be found in many forms, but their purpose is the same: to bridge the gap that exists between two electrical parts. These pads are typically dough-like and soft, which makes them easy to conform and fill air spaces on your device. The gap fillers have been designed to be compressed. The pressure transforms the material into a microscopic texture that maximizes thermal conductivity.

What is Thermal Gap Pad ,The gaps between components. They are also very insulating. They are also flexible, reducing stress on your components. They protect them from vibrations and shearing. Thermal gap fillers are available in a wide variety of thicknesses and hardnesses, with varying thermal conductivity ratings. They are available as sheets or die-cuts and with a wide range of shear resistant carrier options including Kapton and PEN.

To choose the best thermal gap filler, you first need to identify the gaps between your components and the tolerances they have. After identifying the gaps and tolerances between your components, you must select a thermal gap filler that has the right compressibility and shear force. When compressing the gap filler, it is important to consider how much force will be applied. The more pressure that is placed on the gap filler, the more it will deform and out-gas – negatively impacting its thermal properties.

The compression data on the data sheet of a thermal gap-filler can be useful, but it is important to know how much pressure is actually placed on the gap-filler during manufacturing and assembly. The forces will be higher if the pad’s compression is high.

Bergquist offers GAP PAD silicone thermal gaps fillers with a modulus that is ideal for the electronics industry. The GAP PAD 1500 Series was developed for high-speed applications with low tolerance. It features a blend of silicone and filler that offers low-modulus properties while maintaining optimal thermal performance. These gap fillers are also made in the USA and feature inherent tack on both sides of the material to aid in the assembly process. The materials can be used with most adhesives. They can also die-cut using traditional steel-rule shaped dies.

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